Invention Grant
US08835972B2 Light emitting device, method for fabricating the light emitting device, light emitting device package and lighting system 有权
发光器件,制造发光器件的方法,发光器件封装和照明系统

Light emitting device, method for fabricating the light emitting device, light emitting device package and lighting system
Abstract:
Provided is a light emitting device. The light emitting device includes a light emitting structure layer including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer, a first electrode electrically connected to the first conductive type semiconductor layer, an insulating support member under the light emitting structure layer, and a plurality of conductive layers between the light emitting structure layer and the insulating support member. At least one of the plurality of conductive layers has a width greater than that of the light emitting structure layer and includes a contact part disposed further outward from a sidewall of the light emitting structure layer.
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