Invention Grant
- Patent Title: Light emitting device, method for fabricating the light emitting device, light emitting device package and lighting system
- Patent Title (中): 发光器件,制造发光器件的方法,发光器件封装和照明系统
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Application No.: US14070740Application Date: 2013-11-04
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Publication No.: US08835972B2Publication Date: 2014-09-16
- Inventor: Hwan Hee Jeong
- Applicant: Hwan Hee Jeong
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Ked & Associates, LLP
- Priority: KR10-2010-0104232 20101025; KR10-2010-0107293 20101029; KR10-2010-0107294 20101029
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/38 ; H01L33/40 ; H01L33/44 ; H01L33/22

Abstract:
Provided is a light emitting device. The light emitting device includes a light emitting structure layer including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer, a first electrode electrically connected to the first conductive type semiconductor layer, an insulating support member under the light emitting structure layer, and a plurality of conductive layers between the light emitting structure layer and the insulating support member. At least one of the plurality of conductive layers has a width greater than that of the light emitting structure layer and includes a contact part disposed further outward from a sidewall of the light emitting structure layer.
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Information query
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