Invention Grant
- Patent Title: Semiconductor device and fabricating method thereof
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US13426931Application Date: 2012-03-22
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Publication No.: US08836017B2Publication Date: 2014-09-16
- Inventor: Tsung-Hsiung Lee , Shang-Hui Tu
- Applicant: Tsung-Hsiung Lee , Shang-Hui Tu
- Applicant Address: TW Hsinchu
- Assignee: Vanguard International Semiconductor Corporation
- Current Assignee: Vanguard International Semiconductor Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW101101042A 20120111
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/336

Abstract:
A semiconductor device is provided. The semiconductor device includes a plurality of first epitaxial layers, a second epitaxial layer and a gate structure. The plurality of first epitaxial layers is stacked on a substrate and has a first conductivity type. Each first epitaxial layer includes at least one first doping region and at least one second doping region adjacent thereto. The first doping region has a second conductivity and the second doping region has the first conductivity type. The second epitaxial layer is disposed on the plurality of first epitaxial layers, having the first conductivity type. The second epitaxial layer has a trench therein and a third doping region having the second conductivity type is adjacent to a sidewall of the trench. The gate structure is disposed on the second epitaxial layer above the second doping region. A method of fabricating a semiconductor device is also disclosed.
Public/Granted literature
- US20130175608A1 SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF Public/Granted day:2013-07-11
Information query
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