Invention Grant
US08836100B2 Slotted configuration for optimized placement of micro-components using adhesive bonding
有权
开槽配置,用于使用粘合剂粘合优化微组件的放置
- Patent Title: Slotted configuration for optimized placement of micro-components using adhesive bonding
- Patent Title (中): 开槽配置,用于使用粘合剂粘合优化微组件的放置
-
Application No.: US12955011Application Date: 2010-11-29
-
Publication No.: US08836100B2Publication Date: 2014-09-16
- Inventor: Mary Nadeau , Vipulkumar Patel , Prakash Gothoskar , John Fangman , John Matthew Fangman , Mark Webster
- Applicant: Mary Nadeau , Vipulkumar Patel , Prakash Gothoskar , John Fangman , John Matthew Fangman , Mark Webster
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Patterson & Sheridan, LLP
- Main IPC: H01L23/06
- IPC: H01L23/06 ; G02B6/38

Abstract:
An arrangement for improving adhesive attachment of micro-components in an assembly utilizes a plurality of parallel-disposed slots formed in the top surface of the substrate used to support the micro-components. The slots are used to control the flow and “shape” of an adhesive “dot” so as to quickly and accurately attach a micro-component to the surface of a substrate. The slots are formed (preferably, etched) in the surface of the substrate in a manner that lends itself to reproducible accuracy from one substrate to another. Other slots (“channels”) may be formed in conjunction with the bonding slots so that extraneous adhesive material will flow into these channels and not spread into unwanted areas.
Public/Granted literature
- US20110127633A1 Slotted Configuration for Optimized Placement of Micro-Components using Adhesive Bonding Public/Granted day:2011-06-02
Information query
IPC分类: