Invention Grant
- Patent Title: Chip-level humidity protection
- Patent Title (中): 芯片级湿度保护
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Application No.: US13650872Application Date: 2012-10-12
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Publication No.: US08836133B2Publication Date: 2014-09-16
- Inventor: Jenn Hwa Huang , Jose L. Suarez , Yun Wei
- Applicant: Jenn Hwa Huang , Jose L. Suarez , Yun Wei
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agency: Lempia Summerfield Katz LLC
- Main IPC: H01L23/532
- IPC: H01L23/532
Abstract:
An electronic apparatus includes a semiconductor substrate, a device structure supported by the semiconductor substrate, and a guard ring surrounding the device structure. The guard ring includes a plurality of conductive structures spaced apart from one another, supported by the semiconductor substrate, and coupled to a voltage source to establish an operating voltage for the guard ring.
Public/Granted literature
- US20140103532A1 CHIP-LEVEL HUMIDITY PROTECTION Public/Granted day:2014-04-17
Information query
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