Invention Grant
- Patent Title: Interposer for stacked semiconductor devices
- Patent Title (中): 堆叠半导体器件用插入器
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Application No.: US13687198Application Date: 2012-11-28
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Publication No.: US08836148B2Publication Date: 2014-09-16
- Inventor: Peter Gillingham
- Applicant: Mosaid Technologies Incorporated
- Applicant Address: CA
- Assignee: Conversant Intellectual Property Management Inc.
- Current Assignee: Conversant Intellectual Property Management Inc.
- Current Assignee Address: CA
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L25/065 ; H01L23/13 ; H01L23/31 ; H01L23/498
Abstract:
A semiconductor device is disclosed, comprising a substrate having at least one substrate bonding pad. A plurality of semiconductor dies are stacked on the substrate. Each semiconductor die has at least one die bonding pad located on an active surface of the die. A plurality of interposers are each mounted on a corresponding one of the semiconductor dies. Each interposer has an aperture formed therethrough in alignment with the at least one die bonding pad. An electrical connection between the at least one die bonding pad and the at least one substrate bonding pad is formed at least in part by the interposer. The electrical connection includes at least one wire bond.
Public/Granted literature
- US20130134607A1 INTERPOSER FOR STACKED SEMICONDUCTOR DEVICES Public/Granted day:2013-05-30
Information query
IPC分类:
