Invention Grant
- Patent Title: Probe card partition scheme
- Patent Title (中): 探测卡分区方案
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Application No.: US13273633Application Date: 2011-10-14
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Publication No.: US08836363B2Publication Date: 2014-09-16
- Inventor: Sandeep Kumar Goel , Mill-Jer Wang
- Applicant: Sandeep Kumar Goel , Mill-Jer Wang
- Applicant Address: TW
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW
- Agency: Lowe Hauptman & Ham, LLP
- Main IPC: G01R31/00
- IPC: G01R31/00 ; G01R31/28 ; G01R31/319
Abstract:
A method of probe card partitioning for testing an integrated circuit die includes providing a first probe card partition layout having a first number of distinct sections. Each distinct section uses a distinct probe card for testing. The first probe card partition layout is repartitioned into a second probe card partition layout having a second number of distinct sections. The second number is less than the first number.
Public/Granted literature
- US20130093452A1 PROBE CARD PARTITION SCHEME Public/Granted day:2013-04-18
Information query
