A keypad for a wireless device is disclosed. The keypad comprises one or more key stems, each key stem having an upper key stem surface. The keypad also comprises one or more keycaps configured to be mounted over the one or more key stems, each keycap having a lower keycap surface for bonding to the upper key stem surface of each key stem with adhesive. The upper key stem surface includes at least one depression and at least one groove along a perimeter of the upper key stem surface. The depression and groove can help reduce the risk of adhesive flow to undesirable areas.