Invention Grant
- Patent Title: Multilayer ceramic electronic component and method of fabricating the same
- Patent Title (中): 多层陶瓷电子元件及其制造方法
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Application No.: US13620635Application Date: 2012-09-14
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Publication No.: US08837112B2Publication Date: 2014-09-16
- Inventor: Hyun Hee Gu , Myung Jun Park , Kyu Ha Lee , Da Young Choi , Jae Young Park , Sang Hoon Kwon , Byung Jun Jeon
- Applicant: Hyun Hee Gu , Myung Jun Park , Kyu Ha Lee , Da Young Choi , Jae Young Park , Sang Hoon Kwon , Byung Jun Jeon
- Applicant Address: KR Suwon, Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon, Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2012-0070184 20120628
- Main IPC: H01G4/06
- IPC: H01G4/06 ; H01G4/30 ; H01G4/005

Abstract:
There is provided a multilayer ceramic electronic component, including: a ceramic body including a dielectric layer; a plurality of internal electrodes disposed to face each other within the ceramic body, having the dielectric layer interposed therebetween; and external electrodes electrically connected to the internal electrodes, wherein the ceramic body includes an active layer corresponding to a capacitance forming part and a cover layer formed on at least one of an upper surface and a lower surface of the active layer and corresponding to a non-capacitance forming part, an average thickness of the cover layer is 15 μm or less, the external electrodes include a conductive metal and a glass, and when an area of the external electrodes occupied by the glass is A and an area thereof occupied by the conductive metal is B, 0.05≦A/B≦0.6 is satisfied.
Public/Granted literature
- US20140002950A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME Public/Granted day:2014-01-02
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