Invention Grant
- Patent Title: Electronic component and method of manufacturing electronic component
- Patent Title (中): 电子元器件及其制造方法
-
Application No.: US13307029Application Date: 2011-11-30
-
Publication No.: US08837149B2Publication Date: 2014-09-16
- Inventor: Shinichi Hirose , Taisuke Iwai , Yoshitaka Yamaguchi , Yohei Yagishita , Yukie Sakita , Masaaki Norimatsu
- Applicant: Shinichi Hirose , Taisuke Iwai , Yoshitaka Yamaguchi , Yohei Yagishita , Yukie Sakita , Masaaki Norimatsu
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Priority: JP2011-039561 20110225
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L21/50 ; H01L21/48 ; H01L23/433 ; H01L23/42 ; H01L23/373
Abstract:
A method of manufacturing an electronic component includes disposing a heat radiation material including a plurality of linear structures of carbon atoms and a filling layer of a thermoplastic resin provided among the plurality of linear structures above a first substrate, disposing a blotting paper above the heat radiation material, making a heat treatment at a temperature higher than a melting temperature of the thermoplastic resin and absorbing the thermoplastic resin above the plurality of linear structures with the absorption paper, removing the blotting paper, and adhering the heat radiation material to the first substrate by cooling to solidify the thermoplastic resin.
Public/Granted literature
- US20120218715A1 ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT Public/Granted day:2012-08-30
Information query
