• Patent Title: Joints with very low resistance between superconducting wires and methods for making such joints
  • Application No.: US13984225
    Application Date: 2011-12-09
  • Publication No.: US08838194B2
    Publication Date: 2014-09-16
  • Inventor: Simon James Calvert
  • Applicant: Simon James Calvert
  • Applicant Address: GB Camberley
  • Assignee: Siemens PLC
  • Current Assignee: Siemens PLC
  • Current Assignee Address: GB Camberley
  • Agency: Schiff Hardin LLP
  • Priority: GB1102153.2 20110208
  • International Application: PCT/GB2011/052448 WO 20111209
  • International Announcement: WO2012/107709 WO 20120816
  • Main IPC: H01L39/24
  • IPC: H01L39/24 H01L39/02 H01L39/14
Joints with very low resistance between superconducting wires and methods for making such joints
Abstract:
In a method or joint for joining first and second semiconductor wires, each comprising a number of filaments which each comprise a superconductive core within a respective sheath, the filaments being embedded within a matrix and wherein the superconductive cores comprise magnesium diboride and the sheaths comprise niobium, over a certain length a matrix is removed to expose the filaments. The exposed filaments are immersed in molten tin such that the nobium of the sheaths is converted to niobium-tin throughout a thickness of the sheaths. A superconductive path is provided between the superconductive cores of filaments of the first wire through the niobium-tin sheaths of the filaments to the superconductive cores of the second wire.
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