Invention Grant
- Patent Title: Device pairing via device to device contact
- Patent Title (中): 设备配对通过设备与设备的联系
-
Application No.: US12932624Application Date: 2011-02-28
-
Publication No.: US08839389B2Publication Date: 2014-09-16
- Inventor: Alexander J. Cohen , Edward K. Y. Jung , Royce A. Levien , Robert W. Lord , Mark A. Malamud , John D. Rinaldo, Jr.
- Applicant: Alexander J. Cohen , Edward K. Y. Jung , Royce A. Levien , Robert W. Lord , Mark A. Malamud , John D. Rinaldo, Jr.
- Applicant Address: US WA Bellevue
- Assignee: The Invention Science Fund I, LLC
- Current Assignee: The Invention Science Fund I, LLC
- Current Assignee Address: US WA Bellevue
- Main IPC: H04B5/00
- IPC: H04B5/00 ; H04B7/00 ; G06F7/04 ; H04W4/00 ; H04W12/06 ; H04W12/08 ; H04L29/06
Abstract:
A system may include and/or involve a first device, a second device, and logic to effect pairing of the first and second devices upon detection of physical contact between the devices.
Public/Granted literature
- US20110258689A1 Device pairing via device to device contact Public/Granted day:2011-10-20
Information query
