Invention Grant
- Patent Title: Machining apparatus and process
- Patent Title (中): 加工设备及工艺
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Application No.: US12708959Application Date: 2010-02-19
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Publication No.: US08839497B2Publication Date: 2014-09-23
- Inventor: Yung C. Shin
- Applicant: Yung C. Shin
- Applicant Address: US IN West Lafayette
- Assignee: Purdue Research Foundation
- Current Assignee: Purdue Research Foundation
- Current Assignee Address: US IN West Lafayette
- Agency: Hartman Global IP Law
- Agent Gary M. Hartman; Michael D. Winter
- Main IPC: B23K26/00
- IPC: B23K26/00 ; B23B27/10 ; B23P25/00 ; B23Q11/10

Abstract:
A machining process and apparatus capable of increasing removal rates achievable when machining titanium and its alloys. The process includes heating a portion of a workpiece with a laser beam, cryogenically cooling a cutting tool with a cryogenic fluid without flowing the cryogenic fluid onto the workpiece, and machining the heated portion of the workpiece with the cutting tool. The apparatus includes a cutting tool, a device for heating a portion of a workpiece with a laser beam prior to being machined with the cutting tool, and a device for cryogenically cooling the cutting tool with a cryogenic fluid without flowing the cryogenic fluid onto the workpiece. The cryogenic fluid is circulated around the cutting tool to achieve a temperature differential between the workpiece and the cutting tool that is capable of improving removal rates and extending tool life at cutting speeds of, for example, above 100 m/min.
Public/Granted literature
- US20110048183A1 MACHINING APPARATUS AND PROCESS Public/Granted day:2011-03-03
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