Invention Grant
- Patent Title: Method of making a high frequency device package
- Patent Title (中): 制造高频器件封装的方法
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Application No.: US13308351Application Date: 2011-11-30
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Publication No.: US08839508B2Publication Date: 2014-09-23
- Inventor: Eric A. Sanjuan , Sean S. Cahill
- Applicant: Eric A. Sanjuan , Sean S. Cahill
- Applicant Address: DE Fridolfing
- Assignee: Rosenberger Hochfrequenztechnick GmbH & Co. KG
- Current Assignee: Rosenberger Hochfrequenztechnick GmbH & Co. KG
- Current Assignee Address: DE Fridolfing
- Agency: DeLio, Peterson & Curcio, LLC
- Agent Robert Curcio
- Main IPC: H01R43/00
- IPC: H01R43/00 ; H01L23/66 ; H01L23/00 ; H01L23/047 ; H05K1/02
Abstract:
A fabrication method for a low-cost high-frequency electronic device package having waveguide structures formed from the high frequency device to the package lead transition. The package lead transition is optimized to take advantage of waveguide interconnect structure.
Public/Granted literature
- US20120066894A1 LOW COST HIGH FREQUENCY DEVICE PACKAGE AND METHODS Public/Granted day:2012-03-22
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