Invention Grant
- Patent Title: Method for manufacturing electronic apparatus
- Patent Title (中): 电子设备制造方法
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Application No.: US13596188Application Date: 2012-08-28
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Publication No.: US08839509B2Publication Date: 2014-09-23
- Inventor: Noriyuki Kakimoto , Masao Yamada
- Applicant: Noriyuki Kakimoto , Masao Yamada
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2011-189821 20110831
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H01L23/00 ; H05K7/14 ; H01L23/498 ; H01L23/495 ; H01L25/18 ; H01L25/07 ; H01L25/16

Abstract:
Multiple high-voltage side and low-voltage side electric conductors are formed from one sheet of a conductive plate in such a way that the multiple electric conductors are arranged in parallel to one another across an initial gap between the high-voltage side and the low-voltage side electric conductors. The multiple electric conductors are connected to one another via connecting portions. An intermediate portion of the connecting portion is deformed so as to reduce the initial gap to a smaller adjusted gap. Portions of the electric conductors as well as switching devices mounted to the electric conductors are sealed by sealing material. The connecting portions are cut away so that the electric conductors are finally separated from one another.
Public/Granted literature
- US20130047426A1 METHOD FOR MANUFACTURING ELECTRONIC APPARATUS Public/Granted day:2013-02-28
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