Invention Grant
- Patent Title: Measurement method and measurement device
- Patent Title (中): 测量方法和测量装置
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Application No.: US13128349Application Date: 2009-12-09
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Publication No.: US08839671B2Publication Date: 2014-09-23
- Inventor: Mitsuru Sueki
- Applicant: Mitsuru Sueki
- Applicant Address: JP Saitama-Ken
- Assignee: TS Tech Co., Ltd.
- Current Assignee: TS Tech Co., Ltd.
- Current Assignee Address: JP Saitama-Ken
- Agency: Browdy and Neimark, PLLC
- Priority: JP2008-313391 20081209
- International Application: PCT/JP2009/070615 WO 20091209
- International Announcement: WO2010/067826 WO 20100617
- Main IPC: G01N29/00
- IPC: G01N29/00 ; G01N3/48 ; G01N3/40 ; G01B5/06

Abstract:
In the measurement method, a vibrator (5) of a detection unit (4) is relatively moved against a plate (3) of which surface is flat having predetermined area. The vibrator (5) which is vibrating is moved closer to a surface of an object-to-be-measured (1) which is mounted on the plate (3) until the frequency thereof is varied. A position where the frequency of the vibrator (5) is varied is output as a contact position where the vibrator (5) is contacted to the object-to-be-measured (1). Then, thickness of the object-to-be-measured (1) is measured by comparing the position where the vibrator (5) is contacted to the object-to-be-measured (1) with a surface position of the plate (3).
Public/Granted literature
- US20120103100A1 MEASUREMENT METHOD AND MEASUREMENT DEVICE Public/Granted day:2012-05-03
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