Invention Grant
- Patent Title: Slip-layer fluid placement
- Patent Title (中): 滑层流体放置
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Application No.: US12866507Application Date: 2008-02-27
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Publication No.: US08839865B2Publication Date: 2014-09-23
- Inventor: Dean Willberg , Kseniya Evgenievna Eliseeva
- Applicant: Dean Willberg , Kseniya Evgenievna Eliseeva
- Applicant Address: US TX Sugar Land
- Assignee: Schlumberger Technology Corporation
- Current Assignee: Schlumberger Technology Corporation
- Current Assignee Address: US TX Sugar Land
- Agent Jeremy D. Tillman; Rachel Greene; Tim Curington
- International Application: PCT/RU2008/000108 WO 20080227
- International Announcement: WO2009/113896 WO 20090917
- Main IPC: E21B43/26
- IPC: E21B43/26 ; E21B43/267

Abstract:
A method of fluid placement in a hydraulic fracture created in a subterranean formation penetrated by a wellbore that comprises the use of one or more reactants that form a low friction layer between the fluids that penetrate the fracture in consecutive treatment stages. Reactants can be added to the fluid that is the carrier or other fluid to be placed in a specific region of the fracture, namely as an upper or lower boundary of the fracture, or added to both the stage that requires placement in a specific section of the fracture and in the stage preceding it, especially the pad and carrier fluids used in consecutive stages.
Public/Granted literature
- US20110036583A1 SLIP-LAYER FLUID PLACEMENT Public/Granted day:2011-02-17
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