Invention Grant
US08840148B2 Adduction assembly with a “T” joint for an air conditioning circuit
有权
具有用于空调电路的“T”接头的接合组件
- Patent Title: Adduction assembly with a “T” joint for an air conditioning circuit
- Patent Title (中): 具有用于空调电路的“T”接头的接合组件
-
Application No.: US13057638Application Date: 2009-08-05
-
Publication No.: US08840148B2Publication Date: 2014-09-23
- Inventor: Roberto Defilippi
- Applicant: Roberto Defilippi
- Applicant Address: IT Turin
- Assignee: Dytech-Dynamic Fluid Technologies S.p.A.
- Current Assignee: Dytech-Dynamic Fluid Technologies S.p.A.
- Current Assignee Address: IT Turin
- Agency: Gottlieb, Rackman & Reisman, P.C.
- Priority: ITTO2008A0622 20080806
- International Application: PCT/IB2009/006447 WO 20090805
- International Announcement: WO2010/015912 WO 20100211
- Main IPC: F16L13/007
- IPC: F16L13/007 ; F16L41/02 ; F16L47/32 ; F16L41/00 ; F16L47/24 ; G01L19/00
Abstract:
A coolant adducting assembly for a climate control system of a vehicle comprises a joint and a pipe connected to the joint, wherein pipe and joint comprise a thermoplastic material and the joint comprises an insert made of a more rigid material than the thermoplastic material and has an anchoring portion co-molded into the joint and a connecting portion exiting the joint and adapted to be firmly connected to a device.
Public/Granted literature
- US20120018995A1 ADDUCTION ASSEMBLY WITH A "T" JOINT FOR AN AIR CONDITIONING CIRCUIT Public/Granted day:2012-01-26
Information query
