Invention Grant
- Patent Title: Integrated circuit method with triple patterning
- Patent Title (中): 具有三重图案化的集成电路方法
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Application No.: US14043371Application Date: 2013-10-01
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Publication No.: US08840796B2Publication Date: 2014-09-23
- Inventor: Chia-Chu Liu , Kuei-Shun Chen , Meng-Wei Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01B13/00
- IPC: H01B13/00 ; H01L27/02 ; H01L21/311 ; H01L21/308

Abstract:
The present disclosure provides one embodiment of an integrated circuit (IC) design method. The method includes receiving an IC design layout having a plurality of IC features. The method includes identifying, from the IC design layout, simple features as a first layout wherein the first layout does not violate design rules; and complex features as a second layout wherein the second layout violates the design rules. The method further includes generating a third layout and a fourth layout from the second layout wherein the third layout includes the complex features and connecting features to meet the design rules and the fourth layout includes trimming features.
Public/Granted literature
- US20140024218A1 Integrated Circuit Method With Triple Patterning Public/Granted day:2014-01-23
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