Invention Grant
- Patent Title: Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same
- Patent Title (中): 导电接合材料，与其接合的方法和与其接合的半导体器件
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Application No.: US12768778Application Date: 2010-04-28
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Publication No.: US08840811B2Publication Date: 2014-09-23
- Inventor: Yuusuke Yasuda , Toshiaki Morita , Eiichi Ide , Teiichi Inada
- Applicant: Yuusuke Yasuda , Toshiaki Morita , Eiichi Ide , Teiichi Inada
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2009-109315 20090428
- Main IPC: H01B1/00
- IPC: H01B1/00 ; H01B1/12 ; H01L23/15 ; C22C1/05 ; H01L23/14 ; H01L23/373 ; H01L23/488 ; H01L23/13 ; H01L23/498 ; B22F1/00 ; H01L23/492 ; H01B1/22 ; H01L25/07 ; H01L23/34 ; B23K20/00 ; B23K28/00 ; B05D5/12 ; H01L23/24 ; H01L21/56 ; H01L23/10 ; H01L23/00 ; H01L23/495 ; H01L23/31 ; H01L23/049
Abstract:
The present invention provides a bonding material and a method of bonding for metal bonding at a bonding interface capable of a higher bonding strength at a lower temperature without application of pressure, compared to a bonding material of metal particles having an average particle size of not greater than 100 nm. An electrically conductive bonding material including (A) silver particles, (B) silver oxide, and (C) a dispersant including organic material containing not more than 30 carbon atoms as essential components, wherein a total amount of (A) the silver powder, (B) the silver oxide powder, and (C) the dispersant including an organic material containing not more than 30 carbon atoms is in a range of 99.0% to 100% by weight, is provided. In other words, no resin binder is contained.
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