Invention Grant
- Patent Title: Material processing systems
- Patent Title (中): 材料加工系统
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Application No.: US13039176Application Date: 2011-03-02
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Publication No.: US08840832B2Publication Date: 2014-09-23
- Inventor: Mark W. Broadley , James Alan Sago , John Eckert , Jeffrey M. Farina
- Applicant: Mark W. Broadley , James Alan Sago , John Eckert , Jeffrey M. Farina
- Applicant Address: US MA Wilmington
- Assignee: Accellent Inc.
- Current Assignee: Accellent Inc.
- Current Assignee Address: US MA Wilmington
- Agency: Ganz Law, P.C.
- Main IPC: B22F3/24
- IPC: B22F3/24 ; B22F3/20 ; B28B3/20 ; B22F3/10 ; B28B11/24 ; C08K3/08 ; C08K3/34

Abstract:
Material processing systems are disclosed. Some systems include methods of eliminating or reducing defects in elongate workpieces that can undergo large deformations during processing. Some systems include apparatus configured to facilitate such large deformations while maintaining internal stresses (e.g., tensile stresses) below a threshold stress. Some disclosed systems pertain to powder extrusion techniques. Continuous and batch processing systems are disclosed.
Public/Granted literature
- US20120225989A1 MATERIAL PROCESSING SYSTEMS Public/Granted day:2012-09-06
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