The curable resin composition of the present invention contains inorganic particles and a curable resin. The inorganic particles includes an inorganic particle (a-1) having a Mohs hardness of 7 or more and an average particle diameter of 1 μm or less, an inorganic particle (a-2) having a Mohs hardness of 4 or more to less than 7 and an average particle diameter of 1 μm or less, and an inorganic particle (a-3) having a Mohs hardness of less than 4 and an average particle diameter of 1 μm or less. The curable resin is at least one selected from a group consisting of a thermosetting resin and an active energy ray-curable resin.