Invention Grant
- Patent Title: Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and semiconductor device including the photosensitive resin film
- Patent Title (中): 正型感光性树脂组合物，使用其制备的感光性树脂膜和包含感光性树脂膜的半导体装置
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Application No.: US13294223Application Date: 2011-11-11
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Publication No.: US08841064B2Publication Date: 2014-09-23
- Inventor: Myoung-Hwan Cha , Jong-Hwa Lee , Mi-Ra Im , Min-Kook Chung , Ji-Young Jeong , Hyun-Yong Cho , Hwan-Sung Cheon
- Applicant: Myoung-Hwan Cha , Jong-Hwa Lee , Mi-Ra Im , Min-Kook Chung , Ji-Young Jeong , Hyun-Yong Cho , Hwan-Sung Cheon
- Applicant Address: KR Gumi-si
- Assignee: Cheil Industries Inc.
- Current Assignee: Cheil Industries Inc.
- Current Assignee Address: KR Gumi-si
- Agency: Additon, Higgins & Pendleton, P.A.
- Priority: KR10-2010-0140594 20101231
- Main IPC: G03C1/06
- IPC: G03C1/06 ; G03C1/00 ; G03F7/004 ; G03F7/008 ; G03F7/016 ; G03F7/031 ; G03F7/023 ; H01L23/29 ; G03F7/022 ; G03F7/075
Abstract:
Disclosed are a positive photosensitive resin composition that includes (A) an alkali soluble resin; (B) a dissolution controlling agent including the compound represented by Chemical Formula 6; (C) a photosensitive diazoquinone compound; (D) a silane compound; and (E) a solvent, and a photosensitive resin film prepared by using the same.
Public/Granted literature
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