Invention Grant
- Patent Title: Solid-state image pick-up device and manufacturing method thereof, image-pickup apparatus, semiconductor device and manufacturing method thereof, and semiconductor substrate
- Patent Title (中): 固体摄像装置及其制造方法，摄像装置，半导体装置及其制造方法以及半导体基板
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Application No.: US14044644Application Date: 2013-10-02
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Publication No.: US08841158B2Publication Date: 2014-09-23
- Inventor: Shin Iwabuchi
- Applicant: Sony Corporation
- Applicant Address: JP
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP
- Agency: Sheridan Ross P.C.
- Priority: JP2009-026368 20090206
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/322 ; H01L31/18 ; H01L27/146 ; H01L21/762 ; H01L27/12
Abstract:
A solid-state image pick-up device is provided which includes a semiconductor substrate main body which has an element forming layer and a gettering layer provided on an upper layer thereof; photoelectric conversion elements, each of which includes a first conductive type region, provided in the element forming layer; and a dielectric film which is provided on an upper layer of the gettering layer and which induces a second conductive type region in a surface of the gettering layer.
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Information query
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