Invention Grant
- Patent Title: Semiconductor device and method of manufacturing same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13766566Application Date: 2013-02-13
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Publication No.: US08841191B2Publication Date: 2014-09-23
- Inventor: Akira Hokazono , Yoshiyuki Kondo , Toshitaka Miyata
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Knobbe, Martens, Olson & Bear LLP
- Priority: JP2012-184474 20120823
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/78 ; H01L29/66 ; H01L29/08 ; H01L29/10 ; H01L29/739

Abstract:
In one embodiment, a semiconductor device includes a substrate, a gate insulator on the substrate, and a gate electrode on the gate insulator. The device further includes a source diffusion layer of a first conductivity type and a drain diffusion layer of a second conductivity type disposed on a surface of the substrate so as to sandwich the gate electrode. The device further includes a junction forming region disposed between the source diffusion layer and the drain diffusion layer so as to contact the source diffusion layer. The junction forming region includes a source extension layer of the first conductivity type, a pocket layer of the second conductivity type above the source extension layer, and a diffusion suppressing layer disposed between the source extension layer and the pocket layer and containing carbon so as to suppress diffusion of impurities between the source extension layer and the pocket layer.
Public/Granted literature
- US20140054657A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME Public/Granted day:2014-02-27
Information query
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