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US08841192B2 Methods of forming silicide regions and resulting MOS devices 有权
形成硅化物区域和所得MOS器件的方法

Methods of forming silicide regions and resulting MOS devices
Abstract:
A semiconductor device with improved roll-off resistivity and reliability are provided. The semiconductor device includes a gate dielectric overlying a semiconductor substrate, a gate electrode overlying the gate dielectric, a gate silicide region on the gate electrode, a source/drain region adjacent the gate dielectric, and a source/drain silicide region on the source/drain region, wherein the source/drain silicide region and the gate silicide region have different metal compositions.
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