Simultaneously forming a through silicon via and a deep trench structure

Invention Grant

US08841200B2 Simultaneously forming a through silicon via and a deep trench structure 有权

Title translation: 同时形成贯通硅通孔和深沟槽结构

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Patent Title: Simultaneously forming a through silicon via and a deep trench structure
Patent Title (中): 同时形成贯通硅通孔和深沟槽结构
Application No.: US13875363

Application Date: 2013-05-02
Publication No.: US08841200B2

Publication Date: 2014-09-23
Inventor: Kangguo Cheng , Mukta G. Farooq , Louis L. Hsu
Applicant: International Business Machines Corporation
Applicant Address: US NY Armonk
Assignee: International Business Machines Corporation
Current Assignee: International Business Machines Corporation
Current Assignee Address: US NY Armonk
Agent Matthew C. Zehrer; Steven J. Meyers
Main IPC: H01L21/8249
IPC: H01L21/8249 ; H01L21/76

Simultaneously forming a through silicon via and a deep trench structure

Abstract:

A through silicon via (TSV) and a deep trench capacitor (DTCap) or a deep trench isolation (DTI) are simultaneously formed on the same substrate by a single mask and a single reactive ion etching (RIE). The TSV trench is wider and deeper that the DTCap or DTI trench. The TSV and DTCap or DTI are formed with different dielectric materials on the trench sidewalls. The TSV and DTCap or DTI are perfectly aligned.

Abstract(Chinese):

通过单个掩模和单个反应离子蚀刻（RIE）同时在同一衬底上形成贯通硅通孔（TSV）和深沟槽电容器（DTCap）或深沟槽隔离（DTI）。 TSV沟槽比DTCap或DTI沟槽更宽更深。 TSV和DTCap或DTI在沟槽侧壁上形成有不同的介电材料。 TSV和DTCap或DTI完全对齐。

Public/Granted literature

US20130241034A1 Simultaneously Forming A Through Silicon Via and a Deep Trench Structure Public/Granted day:2013-09-19

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82	....制造器件，例如每一个由许多元件组成的集成电路
H01L21/822	.....衬底是采用硅工艺的半导体的（H01L21/8258优先）
H01L21/8248	......双极和场效应工艺的结合
H01L21/8249	.......双极和MOS工艺