Invention Grant
- Patent Title: Method of forming vertical electronic fuse interconnect structures including a conductive cap
- Patent Title (中): 形成包括导电帽的垂直电子熔断器互连结构的方法
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Application No.: US13552106Application Date: 2012-07-18
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Publication No.: US08841208B2Publication Date: 2014-09-23
- Inventor: Junjing Bao , Elbert Emin Huang , Yan Zun Li , Dan Moy
- Applicant: Junjing Bao , Elbert Emin Huang , Yan Zun Li , Dan Moy
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent L. Jeffrey Kelly; Catherine Ivers
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/82 ; H01L23/52
Abstract:
An electronic fuse structure including a first Mx metal comprising a conductive cap, an Mx+1 metal located above the Mx metal, wherein the Mx+1 metal does not comprise a conductive cap, and a via, wherein the via electrically connects the Mx metal to the Mx+1 metal in a vertical orientation.
Public/Granted literature
- US20140021578A1 VERTICAL ELECTRONIC FUSE Public/Granted day:2014-01-23
Information query
IPC分类:
