Invention Grant
US08841736B2 Integrated circuit with MEMS element and manufacturing method thereof
有权
具有MEMS元件的集成电路及其制造方法
- Patent Title: Integrated circuit with MEMS element and manufacturing method thereof
- Patent Title (中): 具有MEMS元件的集成电路及其制造方法
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Application No.: US13960647Application Date: 2013-08-06
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Publication No.: US08841736B2Publication Date: 2014-09-23
- Inventor: Robert James Pascoe Lander
- Applicant: NXP B.V.
- Applicant Address: NL Eindhoven
- Assignee: NXP, B.V.
- Current Assignee: NXP, B.V.
- Current Assignee Address: NL Eindhoven
- Priority: EP12180166 20120810
- Main IPC: B81B3/00
- IPC: B81B3/00 ; B81C1/00

Abstract:
An integrated circuit comprising a MEMS (microelectromechanical system) element in a plane of the integrated circuit, the MEMS element being suspended in a cavity over a substrate, said cavity including a first cavity region in said plane spatially separating an edge of the MEMS element from a wall section, said edge being arranged to be displaced relative to the wall section; and a second cavity region in said plane forming part of a fluid path further including the first cavity region, said fluid path defining a first volume; and a third cavity region in said plane defining a second volume in fluid connection with the second cavity region, wherein the maximum width of the second cavity region is larger than the maximum width of the third cavity region, the second and third cavity regions having maximum widths that are larger than the maximum width of the first cavity region.
Public/Granted literature
- US20140042563A1 INTEGRATED CIRCUIT WITH MEMS ELEMENT AND MANUFACTURING METHOD THEREOF Public/Granted day:2014-02-13
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