Invention Grant
- Patent Title: 3D power module package
- Patent Title (中): 3D电源模块封装
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Application No.: US13177270Application Date: 2011-07-06
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Publication No.: US08842438B2Publication Date: 2014-09-23
- Inventor: Tae Hoon Kim , Jae Cheon Doh , Seog Moon Choi
- Applicant: Tae Hoon Kim , Jae Cheon Doh , Seog Moon Choi
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd
- Current Assignee: Samsung Electro-Mechanics Co., Ltd
- Current Assignee Address: KR Gyunggi-Do
- Agency: Ladas & Parry, LLP
- Priority: KR10-2010-0134862 20101224
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H01L23/34 ; H01L23/31 ; H01L23/495 ; H01L23/433 ; H01L25/16
Abstract:
Disclosed herein is a 3D power module package, including: a power converting unit packaged to include a heat radiating substrate, a power device connected to the heat radiating substrate, and a lead frame; a controlling unit packaged to include a controlling unit substrate and IC and controlling devices mounted on an upper portion of the controlling unit substrate; and an electrical connecting unit electrically connecting the packaged power converting unit and the packaged controlling unit.
Public/Granted literature
- US20120162931A1 3D POWER MODULE PACKAGE Public/Granted day:2012-06-28
Information query
