Invention Grant
- Patent Title: Pattern forming method and pattern forming apparatus
- Patent Title (中): 图案形成方法和图案形成装置
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Application No.: US13828868Application Date: 2013-03-14
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Publication No.: US08845077B2Publication Date: 2014-09-30
- Inventor: Jun Kodama
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP2010-208323 20100916; JP2011-072576 20110329
- Main IPC: B41J2/15
- IPC: B41J2/15 ; B41J2/045 ; H05K3/12 ; B41J11/00 ; B41J3/407 ; B41J2/01

Abstract:
A pattern forming method includes: a modification treatment step of, in accordance with a pattern to be formed on a pattern forming surface of a base body, applying a light beam having a width smaller than a diameter of each of dots to constitute the pattern, onto a treatment target region including at least outer edges on both sides in a width direction of a region where the pattern is to be formed in the pattern forming surface, thereby carrying out modification treatment on the treatment target region; and a droplet deposition step of ejecting and depositing droplets of a functional liquid by an inkjet method onto the region where the pattern is to be formed including the treatment target region where the modification treatment has been carried out.
Public/Granted literature
- US20130201240A1 PATTERN FORMING METHOD AND PATTERN FORMING APPARATUS Public/Granted day:2013-08-08
Information query
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