An anisotropic conductive adhesive for anisotropic conductive connection of an electronic component to a wiring board under no pressure or a low pressure is prepared by dispersing conductive particles in a binder resin composition. A metal flake powder having a major axis of 10 to 40 μm, a thickness of 0.5 to 2 μm, and an aspect ratio of 5 to 50, is used as the conductive particles, the minor axis of the metal flake power being, in a length, 10 to 50% of the major axis. The amount of the conductive particles contained in the anisotropic conductive adhesive is 5 to 35 mass %.