Invention Grant
US08846182B2 Process for producing transparent conductive transfer plate, transparent conductive transfer plate, process for producing transparent conductive substrate using the transparent conductive transfer plate, transparent conductive substrate, and molded product using the transparent conductive substrate 有权
制造透明导电性转印板,透明导电性转印板,使用透明导电性转印板的透明导电性基板的制造方法,透明导电性基板以及使用该透明导电性基板的成型品

  • Patent Title: Process for producing transparent conductive transfer plate, transparent conductive transfer plate, process for producing transparent conductive substrate using the transparent conductive transfer plate, transparent conductive substrate, and molded product using the transparent conductive substrate
  • Patent Title (中): 制造透明导电性转印板,透明导电性转印板,使用透明导电性转印板的透明导电性基板的制造方法,透明导电性基板以及使用该透明导电性基板的成型品
  • Application No.: US13001496
    Application Date: 2009-06-30
  • Publication No.: US08846182B2
    Publication Date: 2014-09-30
  • Inventor: Yasuo KakiharaMichihisa KyotoKyoichi Suzuki
  • Applicant: Yasuo KakiharaMichihisa KyotoKyoichi Suzuki
  • Applicant Address: JP Hiroshima-ken JP Osaka
  • Assignee: Toda Kogyo Corporation,Fujicopian Co., Ltd.
  • Current Assignee: Toda Kogyo Corporation,Fujicopian Co., Ltd.
  • Current Assignee Address: JP Hiroshima-ken JP Osaka
  • Agency: Nixon & Vanderhye P.C.
  • Priority: JP2008-175560 20080704; JP2009-98298 20090414
  • International Application: PCT/JP2009/003025 WO 20090630
  • International Announcement: WO2010/001591 WO 20100107
  • Main IPC: B32B3/00
  • IPC: B32B3/00 H01B1/22 H05K9/00
Process for producing transparent conductive transfer plate, transparent conductive transfer plate, process for producing transparent conductive substrate using the transparent conductive transfer plate, transparent conductive substrate, and molded product using the transparent conductive substrate
Abstract:
A transparent conductive substrate capable of readily producing a transparent conductive substrate having a low resistance, a high transmittance and an excellent anti-moire property without using a special apparatus and can be applied to production of various extensive substrates by applying a dispersion solution of metal fine particles capable of forming a self-organized film on a support, drying the obtained coating layer and then subjecting the resulting dried material to heat treatment and/or chemical treatment particles on a support, drying the obtained coating layer and then reducing and precipitating the precursor of the metal fine particles, to previously form a transparent conductive film; and then bonding a substrate to the support to transfer the transparent conductive film onto the substrate and releasing the support from the transparent conductive film.
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