Invention Grant
US08846428B2 Method for manufacturing light emitting diode chip with electrodes having smooth surfaces
有权
用于制造具有光滑表面的电极的发光二极管芯片的方法
- Patent Title: Method for manufacturing light emitting diode chip with electrodes having smooth surfaces
- Patent Title (中): 用于制造具有光滑表面的电极的发光二极管芯片的方法
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Application No.: US13942713Application Date: 2013-07-16
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Publication No.: US08846428B2Publication Date: 2014-09-30
- Inventor: Ya-Chi Lien , Tzu-Chien Hung
- Applicant: Advanced Optoelectronic Technology, Inc.
- Applicant Address: TW Hsinchu Hsien
- Assignee: Advanced Optoelectronic Technology, Inc.
- Current Assignee: Advanced Optoelectronic Technology, Inc.
- Current Assignee Address: TW Hsinchu Hsien
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN2012103817443 20121010
- Main IPC: H01L33/06
- IPC: H01L33/06 ; H01L33/18 ; H01L33/36
Abstract:
A method for manufacturing a light emitting diode chip includes the following steps: providing an epitaxial structure having an epitaxial layer; forming a first electrode and a second electrode on the epitaxial layer; coating an inert layer on the epitaxial structure, the first electrode and the second electrode continuously; annealing the first electrode and the second electrode; and removing the inert layer coated on the first electrode and the second electrode to expose the first electrode and the second electrode.
Public/Granted literature
- US20140099739A1 METHOD FOR MANUFACTURING LIGHT EMITTING DIODE CHIP WITH ELECTRODES HAVING SMOOTH SURFACES Public/Granted day:2014-04-10
Information query
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