Invention Grant
- Patent Title: Method for manufacturing a semiconductor device
- Patent Title (中): 半导体器件的制造方法
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Application No.: US13964576Application Date: 2013-08-12
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Publication No.: US08846471B2Publication Date: 2014-09-30
- Inventor: Tatsuyoshi Mihara
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Mattingly & Malur, PC
- Priority: JP2012-194420 20120904
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/66

Abstract:
The improvement of the reliability of a semiconductor device having a split gate type MONOS memory is implemented. An ONO film and a second polysilicon film are sequentially formed so as to fill between a first polysilicon film and a dummy gate electrode. Then, the dummy gate electrode is removed. Then, the top surfaces of the first and second polysilicon films are polished, thereby to form a memory gate electrode formed of the second polysilicon film at the sidewall of a control gate electrode formed of the first polysilicon film via the ONO film. As a result, the memory gate electrode high in perpendicularity of the sidewall, and uniform in film thickness is formed.
Public/Granted literature
- US20140065776A1 METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE Public/Granted day:2014-03-06
Information query
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