Invention Grant
US08846795B2 Method for producing polymer molded article, and polymer molded article
有权
聚合物成型体的制造方法和聚合物成型体
- Patent Title: Method for producing polymer molded article, and polymer molded article
- Patent Title (中): 聚合物成型体的制造方法和聚合物成型体
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Application No.: US13877905Application Date: 2011-12-14
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Publication No.: US08846795B2Publication Date: 2014-09-30
- Inventor: Hironori Tabata , Akira Nakasuga
- Applicant: Hironori Tabata , Akira Nakasuga
- Applicant Address: JP Osaka
- Assignee: Sekisui Chemical Co., Ltd.
- Current Assignee: Sekisui Chemical Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Cheng Law Group, PLLC
- Priority: JP2011-004521 20110113; JP2011-008108 20110118; JP2011-116684 20110525; JP2011-163017 20110726; JP2011-164423 20110727
- International Application: PCT/JP2011/078936 WO 20111214
- International Announcement: WO2012/096091 WO 20120719
- Main IPC: C08K3/00
- IPC: C08K3/00 ; C08F210/00 ; B05D7/02 ; C08J7/02 ; C08K3/18

Abstract:
Provided are a method for producing a polymer molded article, which is capable of increasing crystallinity, heat resistance, and isotropic elastic modulus while maintaining the original shape of a polymer molded body and a polymer molded article obtained by the method and having a high crystallinity, high heat resistance, and a high isotropic elastic modulus. The method for producing a polymer molded article includes the steps of: preparing a polymer material mainly containing a crystalline polymer; and impregnating the polymer material with a first gas having solubility in the crystalline polymer in an atmosphere in which the pressure of the first gas is equal to or higher than atmospheric pressure at a temperature higher than (Tm−30)° C. but lower than (Tm−15)° C., where Tm represents the melting point of the crystalline polymer, to obtain a polymer molded article. The polymer molded article is obtained by such a production method.
Public/Granted literature
- US20130190440A1 METHOD FOR PRODUCING POLYMER MOLDED ARTICLE, AND POLYMER MOLDED ARTICLE Public/Granted day:2013-07-25
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