Invention Grant
- Patent Title: Curable organopolysiloxane composition and semiconductor device
- Patent Title (中): 固化有机聚硅氧烷组合物和半导体器件
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Application No.: US12997177Application Date: 2009-06-11
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Publication No.: US08846828B2Publication Date: 2014-09-30
- Inventor: Takashi Sagawa , Makoto Yoshitake
- Applicant: Takashi Sagawa , Makoto Yoshitake
- Applicant Address: JP Chiyoda-Ku, Tokyo
- Assignee: Dow Corning Toray Co. Ltd.
- Current Assignee: Dow Corning Toray Co. Ltd.
- Current Assignee Address: JP Chiyoda-Ku, Tokyo
- Agency: Howard & Howard Attorneys PLLC
- Priority: JP2008-159723 20080618
- International Application: PCT/JP2009/061138 WO 20090611
- International Announcement: WO2009/154261 WO 20091223
- Main IPC: C08G77/38
- IPC: C08G77/38 ; C08L83/04 ; C08L83/05 ; C08L83/07 ; C08K5/54 ; G02B1/04 ; H01L23/29 ; C08G77/12 ; C08G77/20 ; H01L33/48 ; C08G77/00 ; H01L33/56

Abstract:
A curable organopolysiloxane composition comprising: (A) a branched-chain organopolysiloxane that contains in one molecule at least three alkenyl groups and at least 30 mole % of all silicon-bonded organic groups in the form of aryl groups; (B) a linear-chain organopolysiloxane that contains aryl groups and has both molecular terminals capped with diorganohydrogensiloxy groups; (C) a branched-chain organopolysiloxane that contains in one molecule at least three diorganohydrogensiloxy groups and at least 15 mole % of all silicon-bonded organic groups in the form of aryl groups; and (D) a hydrosilylation catalyst. The composition is capable of forming a cured body that has a high index of refraction and strong adhesion to substrates.
Public/Granted literature
- US20110251356A1 Curable Organopolysiloxane Composition and Semiconductor Device Public/Granted day:2011-10-13
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