Invention Grant
US08847112B2 Method and apparatus to scribe a line in a thin film material using a burst of laser pulses with beneficial pulse shape
有权
使用具有有利脉冲形状的激光脉冲脉冲在薄膜材料中划线的方法和装置
- Patent Title: Method and apparatus to scribe a line in a thin film material using a burst of laser pulses with beneficial pulse shape
- Patent Title (中): 使用具有有利脉冲形状的激光脉冲脉冲在薄膜材料中划线的方法和装置
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Application No.: US12889435Application Date: 2010-09-24
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Publication No.: US08847112B2Publication Date: 2014-09-30
- Inventor: Tullio Panarello , Matthew Rekow , Richard Murison
- Applicant: Tullio Panarello , Matthew Rekow , Richard Murison
- Applicant Address: US CA Quebec
- Assignee: ESI-Pyrophotonics Lasers, Inc.
- Current Assignee: ESI-Pyrophotonics Lasers, Inc.
- Current Assignee Address: US CA Quebec
- Agency: Haynes Beffel & Wolfeld LLP
- Main IPC: B23K26/38
- IPC: B23K26/38

Abstract:
A series of laser pulses in a pulse train, each pulse with a beneficial temporal power shape instead of the conventional laser temporal power shape, scribes a line in a thin film of material on a substrate. The beneficial temporal pulse shape has a spike/plateau chair shape or a square pulse shape. Scribing a line in the thin film is achieved by placing the series of laser pulse spots on the line to be scribed such that there is an overlapping area between adjacent laser pulse spots along the line. The use of a series of laser pulses with beneficial pulse shape to scribe a line in the thin film results in a better quality and cleaner scribing process compared to that achieved with the conventional pulse shape.
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