Invention Grant
US08847340B2 Packaged sensor structure having sensor opening and package opening aligned with sensor element
有权
封装的传感器结构具有与传感器元件对准的传感器开口和封装开口
- Patent Title: Packaged sensor structure having sensor opening and package opening aligned with sensor element
- Patent Title (中): 封装的传感器结构具有与传感器元件对准的传感器开口和封装开口
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Application No.: US13907077Application Date: 2013-05-31
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Publication No.: US08847340B2Publication Date: 2014-09-30
- Inventor: Lorenzo Baldo , Chantal Combi , Mario Francesco Cortese
- Applicant: STMicroelectronics S.r.I.
- Applicant Address: IT Agrate Brianza (MB)
- Assignee: STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza (MB)
- Agency: Graybeal Jackson LLP
- Priority: ITMI2007A0099 20070124
- Main IPC: H01L29/84
- IPC: H01L29/84 ; G01L19/14 ; B81B7/00

Abstract:
Electronic device including a substrate provided with at least one passing opening, a MEMS device with a differential sensor provided with a first and a second surface having at least one portion sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface thereof. The first surface of the MEMS device leaves the first active surface exposed and the second surface being provided with a further opening which exposes said second opposed active surface, the electronic device being characterized in that the first surface of the MEMS device faces the substrate and is spaced therefrom by a predetermined distance, the sensitive portion being aligned to the passing opening of the substrate, and in that it also comprises a protective package, which incorporates at least partially the MEMS device and the substrate.
Public/Granted literature
- US20130264662A1 ELECTRONIC DEVICE, SYSTEM, AND METHOD COMPRISING DIFFERENTIAL SENSOR MEMS DEVICES AND DRILLED SUBSTRATES Public/Granted day:2013-10-10
Information query
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