Invention Grant
US08847340B2 Packaged sensor structure having sensor opening and package opening aligned with sensor element 有权
封装的传感器结构具有与传感器元件对准的传感器开口和封装开口

Packaged sensor structure having sensor opening and package opening aligned with sensor element
Abstract:
Electronic device including a substrate provided with at least one passing opening, a MEMS device with a differential sensor provided with a first and a second surface having at least one portion sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface thereof. The first surface of the MEMS device leaves the first active surface exposed and the second surface being provided with a further opening which exposes said second opposed active surface, the electronic device being characterized in that the first surface of the MEMS device faces the substrate and is spaced therefrom by a predetermined distance, the sensitive portion being aligned to the passing opening of the substrate, and in that it also comprises a protective package, which incorporates at least partially the MEMS device and the substrate.
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