Invention Grant
US08847413B2 Integrated circuit package system with leads having multiple sides exposed
有权
集成电路封装系统，带有多个侧面的引线
- Patent Title: Integrated circuit package system with leads having multiple sides exposed
- Patent Title (中): 集成电路封装系统，带有多个侧面的引线
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Application No.: US12014578Application Date: 2008-01-15
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Publication No.: US08847413B2Publication Date: 2014-09-30
- Inventor: Jae Hak Yee , Byoung Wook Jang
- Applicant: Jae Hak Yee , Byoung Wook Jang
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L31/0203
- IPC: H01L31/0203 ; H01L23/495 ; H01L21/56 ; H01L23/31 ; H01L25/03 ; H01L25/065 ; H01L25/10 ; H01L23/00
Abstract:
An integrated circuit package system includes forming an integrated circuit stack having a bottom non-active side and a top non-active side; connecting an internal interconnect between a lead, having a top side and a bottom side, and the integrated circuit stack; and forming an encapsulation, having both a non-elevated portion and an elevated portion, around the integrated circuit stack and the internal interconnect with the top side exposed at the non-elevated portion, and with the bottom side, the bottom non-active side, and the top non-active side exposed.
Public/Granted literature
- US20080171405A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADS HAVING MULTIPLE SIDES EXPOSED Public/Granted day:2008-07-17
Information query
IPC分类:
