Invention Grant
- Patent Title: Lens plate for wafer-level camera and method of manufacturing same
- Patent Title (中): 晶圆级摄像机透镜板及其制造方法
-
Application No.: US13444618Application Date: 2012-04-11
-
Publication No.: US08848286B2Publication Date: 2014-09-30
- Inventor: Leah Widmer
- Applicant: Leah Widmer
- Applicant Address: US CA Santa Clara
- Assignee: Omni Version Technology, Inc.
- Current Assignee: Omni Version Technology, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lathrop & Gage LLP
- Main IPC: G02B13/14
- IPC: G02B13/14

Abstract:
A lens plate includes a transparent substrate wafer, and a plurality of lenses and spacers that are formed of a single portion of material on the transparent substrate wafer. An assembly includes a first lens plate that includes a first transparent substrate wafer, a plurality of first lenses and a plurality of spacers, the first lenses and spacers being formed of a single portion of material on said first transparent substrate wafer. The assembly also includes a second lens plate that includes a second transparent substrate wafer and a plurality of second lenses formed thereon, each of the plurality of second lenses corresponding to a respective one of the plurality of first lenses. The lens plates are aligned such that each of the plurality of first lenses aligns with the respective one of the plurality of second lenses, and the lens plates are bonded to one another.
Public/Granted literature
- US20130271826A1 Lens Plate For Wafer-Level Camera And Method Of Manufacturing Same Public/Granted day:2013-10-17
Information query