Invention Grant
- Patent Title: Shield case, connector and electronic equipment
- Patent Title (中): 屏蔽盒,连接器和电子设备
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Application No.: US13043880Application Date: 2011-03-09
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Publication No.: US08848387B2Publication Date: 2014-09-30
- Inventor: Takayuki Nagata , Takahisa Ohtsuji
- Applicant: Takayuki Nagata , Takahisa Ohtsuji
- Applicant Address: JP Yao-shi
- Assignee: Hosiden Corporation
- Current Assignee: Hosiden Corporation
- Current Assignee Address: JP Yao-shi
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2010-072566 20100326; JP2010-116038 20100520
- Main IPC: H05K7/10
- IPC: H05K7/10 ; H05K7/12

Abstract:
The present invention provides a shield case having electrical conductivity and being mountable on a circuit board. The shield case includes a first surface adapted to be placed on the circuit board and a second surface provided continuously with the first surface and extending at an angle or at a right angle with respect to the first surface. A first recess of generally U-shape is provided in a boundary area of the first surface with the second surface and including first and second end portions. A pair of second recesses is provided in a boundary area of the second surface with the first surface and communicating with the first and second end portions of the first recess. The shield case also includes a pad, being defined by the first and second recesses and connectable by soldering to an electrode of the circuit board.
Public/Granted literature
- US20110235293A1 SHIELD CASE, CONNECTOR AND ELECTRONIC EQUIPMENT Public/Granted day:2011-09-29
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