Invention Grant
- Patent Title: Distributed RSVP-TE in a multi-chassis node architecture
- Patent Title (中): 分布式RSVP-TE在多机箱节点架构中
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Application No.: US12538315Application Date: 2009-08-10
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Publication No.: US08848712B2Publication Date: 2014-09-30
- Inventor: Ashok Kunjidhapatham , Rajan Rao , Biao Lu , Mohit Misra , Sri Mohana Satya Srinivas Singamsetty
- Applicant: Ashok Kunjidhapatham , Rajan Rao , Biao Lu , Mohit Misra , Sri Mohana Satya Srinivas Singamsetty
- Applicant Address: US CA Sunnyvale
- Assignee: Infinera Corporation
- Current Assignee: Infinera Corporation
- Current Assignee Address: US CA Sunnyvale
- Agency: Harrity & Harrity, LLP
- Agent David L. Soltz
- Main IPC: H04L12/28
- IPC: H04L12/28 ; G06F15/173 ; H04L12/46 ; H04L12/913 ; H04L12/775 ; H04L12/931 ; H04Q11/00

Abstract:
A network device includes a multi-chassis system in which each chassis includes a RSVP-TE protocol stack that may provide RSVP-TE services for LSP tunnels associated with each chassis. The multi-chassis system may include an administrative chassis. The administrative chassis may forward RSVP messages to other chassis of the network device. The administrative chassis may encapsulate the RSVP messages with a chassis address. The other chassis may de-encapsulate the RSVP messages and process the RSVP messages according to the RSVP-TE protocol. The administrative chassis may obtain session information associated with other chassis based on RSVP messages received. The administrative chassis may manage adjacency mechanisms and failure and recovery mechanisms. The multi-chassis system including the distributed RSVP-TE protocol stacks may minimize scalability issues and improve performance when high-capacity routing and/or switching services are needed.
Public/Granted literature
- US20110032938A1 DISTRIBUTED RSVP-TE IN A MULTI-CHASSIS NODE ARCHITECTURE Public/Granted day:2011-02-10
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