Invention Grant
- Patent Title: Implantable medical devices including elongated conductor bodies that facilitate device and lead configuration variants
- Patent Title (中): 可植入的医疗设备包括细长的导体体,便于器件和引线配置变体
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Application No.: US14256955Application Date: 2014-04-19
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Publication No.: US08849405B2Publication Date: 2014-09-30
- Inventor: Dale F. Seeley , Michael T. Hegland
- Applicant: Medtronic, Inc.
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Main IPC: A61N1/375
- IPC: A61N1/375

Abstract:
Implantable medical devices include elongated conductor bodies and related features including an attachment to the medical device at one end and a connector that receives a medical lead at the other end. The connector may have various features such as a modular design whereby the connector is constructed from a series of stacked contact modules. Other features of the connector include electrical contacts that are relatively thin conductors or the order of 0.040 inches or less and that may include radial protrusions to establish contact with the electrical connectors of the lead. Furthermore, electrical contacts may be mounted within the connector in a floating manner so that radial movement of the electrical contact may occur during lead insertion. Additional features include a feedthrough where conductors exposed beyond a housing of the implantable medical device make direct electrical connection to conductors present within the elongated body.
Public/Granted literature
Information query
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