Invention Grant
US08849424B2 Integrated conductive sensor package having conductor bypass, distal electrode, distal adapter and custom molded overlay
有权
具有导体旁路,远端电极,远端适配器和定制模制覆盖层的集成导电传感器封装
- Patent Title: Integrated conductive sensor package having conductor bypass, distal electrode, distal adapter and custom molded overlay
- Patent Title (中): 具有导体旁路,远端电极,远端适配器和定制模制覆盖层的集成导电传感器封装
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Application No.: US12411124Application Date: 2009-03-25
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Publication No.: US08849424B2Publication Date: 2014-09-30
- Inventor: Douglas D. Nippoldt , Thomas D. Brostrom , Richard J. O'Brien , Michael A. Schugt , Scott J. Davis , Yaling Fan
- Applicant: Douglas D. Nippoldt , Thomas D. Brostrom , Richard J. O'Brien , Michael A. Schugt , Scott J. Davis , Yaling Fan
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agent Evans M. Mburu
- Main IPC: A61N1/00
- IPC: A61N1/00 ; A61N1/05 ; A61B5/0215 ; A61N1/37 ; A61B5/042

Abstract:
This disclosure relates to implantable medical devices (IMDs); in particular, to medical electrical leads having an integrated sensor disposed in a hermetic package and said sensor package accommodates a torque coil and an elongated cable conductor extending therethrough. The integrated sensor can include a pressure sensor, an accelerometer, and the like. The coil and the cable can couple to pacing and sensing electrode coupled to the lead distal to the sensor package. The sensor package is compact, substantially circular in cross section and robust, in that the overall design promote mechanical stability.
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