Invention Grant
- Patent Title: Electrostatic chuck with photo-patternable soft protrusion contact surface
- Patent Title (中): 静电卡盘，具有光刻图软突起接触面
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Application No.: US13667516Application Date: 2012-11-02
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Publication No.: US08861170B2Publication Date: 2014-10-14
- Inventor: I-Kuan Lin , Richard A. Cooke , Jakub Rybczynski
- Applicant: Entegris, Inc.
- Applicant Address: US MA Billerica
- Assignee: Entegris, Inc.
- Current Assignee: Entegris, Inc.
- Current Assignee Address: US MA Billerica
- Agency: Hamilton, Brook, Smith & Reynolds, P.C.
- Main IPC: H02N13/00
- IPC: H02N13/00 ; C23C16/458 ; H01L21/683 ; H01L21/687
Abstract:
In accordance with an embodiment of the invention, there is provided a soft protrusion structure for an electrostatic chuck, which offers a non-abrasive contact surface for wafers, workpieces or other substrates, while also having improved manufacturability and compatibility with grounded surface platen designs. The soft protrusion structure comprises a photo-patternable polymer.
Public/Granted literature
- US20130120897A1 Electrostatic Chuck with Photo-Patternable Soft Protrusion Contact Surface Public/Granted day:2013-05-16
Information query
