Invention Grant
- Patent Title: Electroadhesive handling and manipulation
- Patent Title (中): 电动粘合剂处理和操作
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Application No.: US13886048Application Date: 2013-05-02
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Publication No.: US08861171B2Publication Date: 2014-10-14
- Inventor: Harsha Prahlad , Ronald E. Pelrine , Brian K. McCoy
- Applicant: SRI International
- Applicant Address: US CA Menlo Park
- Assignee: SRI International
- Current Assignee: SRI International
- Current Assignee Address: US CA Menlo Park
- Agency: McDonnell Boehnen Hulbert & Berghoff LLP
- Main IPC: H01T23/00
- IPC: H01T23/00 ; H02N13/00 ; B25J15/00

Abstract:
An electroadhesive gripping system includes a shear gripper. The shear gripper can include an electroadhesive surface associated with one or more electrodes and a load-bearing structure coupled to the electroadhesive surface. A power supply can be configured to apply voltage to the one or more electrodes associated with the electroadhesive surface. A controller can be configured to cause a voltage to be applied, via the power supply, to the one or more electrodes associated with the electroadhesive surface to thereby cause the first shear gripper to adhere to an item situated proximate the electroadhesive surface. The controller can be configured to cause a shear force to be applied to the adhered item, via the load-bearing structure, that is sufficient to move the adhered item.
Public/Granted literature
- US20130242455A1 Electroadhesive Handling And Manipulation Public/Granted day:2013-09-19
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