Invention Grant
- Patent Title: Casing for electronic ballast
- Patent Title (中): 电子镇流器套管
-
Application No.: US13256226Application Date: 2010-02-19
-
Publication No.: US08861206B2Publication Date: 2014-10-14
- Inventor: Michele Tiso , Rene Twardzik , Fubing Xie
- Applicant: Michele Tiso , Rene Twardzik , Fubing Xie
- Applicant Address: DE Munich
- Assignee: Osram Gesellschaft mit beschraenkter Haftung
- Current Assignee: Osram Gesellschaft mit beschraenkter Haftung
- Current Assignee Address: DE Munich
- Priority: CN200910127145 20090313
- International Application: PCT/EP2010/052131 WO 20100219
- International Announcement: WO2010/102894 WO 20100916
- Main IPC: H05K5/00
- IPC: H05K5/00

Abstract:
A casing for electronic ballast, in which a PCB assembly is received, may include: a top wall; a bottom wall opposite to the top wall; two opposite side walls extending integrally between the top wall and bottom wall; and two opposite end walls extending integrally from the top wall, wherein the top wall, bottom wall, side walls and end walls are formed integrally, the top wall, bottom wall and side walls define openings at both ends of the casing in a lengthwise direction of the casing, the end walls are arranged to be pivotable relative to the top wall so as to close the openings formed by the top wall, bottom wall and side walls.
Public/Granted literature
- US20120002384A1 CASING FOR ELECTRONIC BALLAST Public/Granted day:2012-01-05
Information query