Invention Grant
- Patent Title: Electromagnetic shield
- Patent Title (中): 电磁屏蔽
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Application No.: US13756909Application Date: 2013-02-01
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Publication No.: US08861209B2Publication Date: 2014-10-14
- Inventor: Brad Subat , Daniel Hodgkins
- Applicant: Bose Corporation
- Applicant Address: US MA Framingham
- Assignee: Bose Corporation
- Current Assignee: Bose Corporation
- Current Assignee Address: US MA Framingham
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K9/00

Abstract:
In an aspect, in general, an apparatus includes an electrically conductive housing including a first portion and second portion, the first portion including electronic circuitry. An electromagnetic shield separates the first portion and the second portion and is configured to electromagnetically isolate the electronic circuitry of the first portion from the second portion. The electromagnetic shield includes a plurality of electrically conductive walls partially separating the first portion and the second portion, a plurality of electrically conductive spring loaded fingers extending from an end of at least one of the plurality of electrically conductive walls and configured to contact an inner surface of the housing. Together, the plurality of electrically conductive walls and the plurality of electrically conductive spring loaded fingers separate the first portion and the second portion.
Public/Granted literature
- US20140218876A1 ELECTROMAGNETIC SHIELD Public/Granted day:2014-08-07
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