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US08861273B2 Bandgap engineered charge trapping memory in two-transistor nor architecture 有权
带隙设计的电荷俘获存储器在双晶体管和架构中

Bandgap engineered charge trapping memory in two-transistor nor architecture
Abstract:
A 2T cell NOR architecture based on the use of BE-SONOS for embedded memory includes memory cells having respective access transistors having access gates and memory transistors having memory gates arranged in series between the corresponding bit lines and one of the plural reference lines. A memory transistor in a memory cell comprises a semiconductor body including a channel having a channel surface and a charge storing dielectric stack between the memory gate and the channel surface. The dielectric stack comprises a bandgap engineered, tunneling dielectric layer contacting one of the gate (for gate injection tunneling) and the channel surface (for channel injection tunneling). The dielectric stack of the memory cell also includes a charge trapping dielectric layer on the tunneling dielectric layer and a blocking dielectric layer.
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