Invention Grant
- Patent Title: Data receiving circuit and data receiving method
- Patent Title (中): 数据接收电路和数据接收方法
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Application No.: US13780980Application Date: 2013-02-28
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Publication No.: US08861659B2Publication Date: 2014-10-14
- Inventor: Hideaki Hasegawa , Kouji Takeda , Toshio Itou , Yuuichi Ike
- Applicant: Lapis Semiconductor Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Lapis Semiconductor Co., Ltd.
- Current Assignee: Lapis Semiconductor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Volentine & Whitt, PLLC
- Priority: JP2012-069681 20120326
- Main IPC: H04L27/08
- IPC: H04L27/08 ; H03G3/30

Abstract:
A data receiving circuit and a data receiving method accurately acquire a data signal corresponding to information data from a high speed high density transmitted signal. An increase or a decrease of the level of one of a amplified data signal and a level converted data signal that is transmitted from one, referred to as one processing stage, of an amplification processing stage and a level converting processing stage, is fed back to a stage preceding the one processing stage. The amplification processing stage supplies, to a first line, an amplified data signal obtained by performing an amplification processing on a received data signal, and the level converting processing stage transmits, via a second line, a level converted data signal obtained by performing a level converting processing on the amplified data signal.
Public/Granted literature
- US20130251077A1 DATA RECEIVING CIRCUIT AND DATA RECEIVING METHOD Public/Granted day:2013-09-26
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